P-2235-G2

As a professional manufacturer specializing in R&D and production of precision EMI shielding components, we proudly launch the P-2235-G2 Through-hole Shielding Cover. This high-performance Shielding Cover features a porous structure as its core advantage, providing global electronics manufacturers with an integrated solution that combines efficient heat dissipation and electromagnetic protection, perfectly meeting the stringent application requirements of high-end overseas electronic devices.
This Shielding Cover is equipped with uniformly distributed high-density precision perforations on its surface. The hole positions are optimized through both electromagnetic and thermal simulations, ensuring efficient EMI shielding effectiveness that effectively blocks external electromagnetic interference and internal signal leakage across the 100MHz to 10GHz frequency band. Meanwhile, it provides sufficient heat dissipation channels for PCB components inside the package, preventing performance degradation or device aging caused by heat accumulation, making it ideal for high-power, highly integrated wireless communication and industrial control modules.

As a Through-hole Shielding Cover, its core through-hole pin design enables through-hole soldering to the PCB. Compared with traditional surface-mount shielding covers, it offers more robust mechanical connections, maintaining zero detachment and cold solder joints even in high-vibration scenarios such as automotive and industrial applications, while ensuring a continuous ground loop to further enhance shielding integrity and signal stability.
The product is made of high-purity conductive alloys (copper-nickel alloy or tin-plated cold-rolled steel optional), formed through precision stamping and eco-friendly electroplating processes. The tin/nickel plating on the surface enhances corrosion resistance and solderability. The aperture, spacing, and layout of the porous structure can be customized according to customer requirements, flexibly balancing heat dissipation efficiency and shielding effectiveness.

This Shielding Cover is widely used in wireless communication modules, IoT smart gateways, automotive ECUs, industrial control motherboards, and other fields, meeting the high demands of overseas customers for equipment stability, heat dissipation efficiency, and electromagnetic compatibility. We support tape-and-reel packaging compatible with SMT automated assembly, which, combined with the through-hole pin design, enables efficient assembly and reduces labor costs for overseas production lines. Backed by the ISO9001 quality management system, the product has obtained international certifications such as CE, FCC, and RoHS. We offer customization of dimensions, hole patterns, materials, and surface treatments, supporting the entire process from prototype sampling to mass production of millions of units.
With the heat dissipation advantages of its porous structure, the mechanical reliability of the through-hole design, and a global service system, the P-2235-G2 Through-hole Shielding Cover has become the preferred Shielding Cover solution for overseas electronics manufacturers, helping customers enhance product performance and market competitiveness.